A-Series Hybrid targets manufacturers in the semiconductor backend industry. Introduces parallel placement technology to applications like SiP, MCM manufacturing, and flip chip bonding. Includes programmable placement force control. Has fluxer dip station and high-accuracy cameras. Can bond flip chips at a repeatability of 10 µm, while placing at 2,500 components per hr. per single placement head. Die bonding speeds are 3,500 cph per head at 25 µm, while passives are placed at 8,000 cph at 40 µm. Can carry up to three specialized twin placement robots, holding two heads per robot, for a total flip chip bonding speed of 15,000 placements per hr. per machine. Can also carry conventional placement robots for chip shooting for passives as small as 01005.

Assembléon, www.assembleon.com

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