ES 808 surface mount adhesive is for bonding of surface-mounted devices to printed circuit boards prior to wave soldering. Is for medium to high dispense speeds and high dot profiles; is suitable for pin transfer and stencil print. Is said to have good humidity resistance, high wet strength and good electrical characteristics, excellent mechanical strength and long-term stability. ES 807 is for high-speed dispensing (25,000 - 50,000 dph). Reportedly has outstanding dot profile, excellent adhesion substrate and wetting strength. Typical cure temperature of 130°C and 90 sec. cure time or 60 sec. at 150°C.

Electrolube, www.electrolube.com

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