BPC-SX2 2D/3D solder paste inspection system is for printing quality analysis and production status control. Features high accuracy; no blind spots; automatic resolution switch; automatic program creation; double speed inspection by quick scanning; 2D/3D normal mode: 4,750mm²/sec.; 2D/3D high-speed mode: 8,200mm²/sec.; optical 2D/3D/axis real-time control; special lighting for green/blue PC boards; multiple slit lighting, and no pixel shift or ghost image. Inspects PCBs from 50 x 50mm to 510 x 460mm. Inspection time in standard mode is 4,750mm²/sec.

DJTECH, http://www.djtech.co.jp/

• Prev
• Next