3D inline x-ray system is available in X3 universal standard system and X3+, with triple detector setup. Both are based on the hardware concept of X2.5. 3D-Software uses a dedicated number of angle projections for 3D reconstruction; delivers 3D slice images needed for solder joint analysis. With algebraic reconstruction method, it is possible to generate high-resolution images for a reliable analysis with only a few projections. Analyze double-sided boards with high packing density. Generated slice images allow a separate 3D analysis for both sides of the board. Include inspection of high power components with heat sinks, where single contact layers can be separated for void or solder wetting analysis; a multilayer analysis of a solder joint is possible with digital 3D tomosynthesis. Use MIPS platform with links to all MIPS software modules for programming, classifying and verification.

MatriX Technologies, www.m-xt.com

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