Zymet Delivers CN-1736 Underfill
Published: 11 January 2012
CN-1736 reworkable underfill encapsulant is designed to underfill 0.4mm pitch package-on-package assemblies. Has low viscosity and CTE. Reportedly has greater flux compatibility than predecessors. Has a viscosity of 650cps and a CTE of 55 ppm/°C. Rework is accomplished with temperature of 170°C to 180°C.
Zymet, www.zymet.com
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