DE-7826 (dam) and CE-7826 (fill) dam and fill chip encapsulants are for chip-on-board applications. Are designed to protect wire bonds and reduce stresses associated with thermal cycling. Are engineered to withstand circuit board reliability test criteria. Have thermal expansion coefficients in the 20ppm range when measured by thermal mechanical analysis. Have high glass transition temperatures and modulus to retain low expansion properties throughout operating temperature range of the circuit board. Meet standards for ionic cleanliness.

Engineered Material Systems, www.conductives.com

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