Machine Vision Products Rolls Out Ultra SPI
Published: 23 February 2012
Ultra SPI solder paste inspection system is based on 64-bit technology. Dual 3D cameras inspect paste deposits on printed circuit boards for multiple defect scenarios. Uses latest Gerber and CAD generation utilities. Can produce a 3D inspection database within of 5 to 10 min. Graphical data output is available. Is 2D/3D capable.
Machine Vision Products, www.visionpro.com
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