Viscom Develops 3-D MID AOI
Published: 30 March 2012
3-D MID automatic inspection system inspects after manufacture of the 3-D MID carrier and entire 3-D MID product. Detects extraneous metallization deposition, separations, short circuits or conductor cracks, missing solder resist, component presence, polarity, correctness and position. Comes with 8M camera.
Viscom, www.viscom.com
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