DB-1590 is a solder replacement in for crystalline silicon solar modules using thinned silicon or plated bus bars. Is optimized for conductivity and stability on various substrates when cured at 200°C. Is said to gel in 5 sec. or less at 200°C, developing sufficient strength to withstand the applied stresses induced by the manufacturing process until the adhesive cure is completed during the encapsulant lamination process. Rheology optimized for dispensing, damp heat resistance and conductivity stability on tin, SnAg and Ag-plated ribbons. Is stable on OSP treated copper and nickel bus bars.

Engineered Conductive Materials, www.conductives.com

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