SN100C P810 D4 lead-free solder paste is said to be lower voiding than conventional lead-free solder. Reportedly minimizes mid-chip solder balling and exhibits good wetting on all common substrates. When used in combination with vacuum reflow, produces solder joints on 19x19 mm pads and joints to power transistors with less than 1% voiding. Is based on SN100C.

Nihon Superior Co., www.nihonsuperior.co.jp/english

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