DDF Innova Direct Die Feeder converts Assembléon’s pick-and-place machine from a high-speed chipshooter into a high-speed flip-chip bonder, feeding devices directly from up to 300-mm wafers. Conversion permits controlled die bonding speeds up to 15,000 components per hour at maximum accuracy, and passive component placements up to 121,000 cph. Handles system-in-package, multichip module, flip-chips and embedded passive and active components. Supplies bare die directly from up to 300mm (12") wafers in flip chip (bumps down) or direct die (bumps up) mode. Wafer mapping ensures that only known-good-dies with sizes from 0.7mm (any edge), are presented to the machine.

Assembléon, www.assembleon.com

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