EPM1-2493 low-viscosity, low modulus silicone elastomer has a nominal thermal conductivity of 1 W/mk. Offers bond lines as thin as 5 microns. Adheres materials with differing coefficients of thermal expansion (CTE) for significant stress reduction during thermal cycling. Reportedly reduces or prevents contamination of electronics components in applications exposed to high heat, such as solder reflow at 260°C. Adheres to aluminum, and with a primer achieves average lap shear values of120 psi (0.8 MPa). Is a pourable, conformal liquid for potting/filling recessed areas. Can be used for adhering integrated circuit substrates, base plates or heat sinks, or where grooves or other configurations require a limited flow material. Comes in a 1:1 mix ratio and can be loaded into syringes and dispensed as a one-part material for automated dispensing. Cures at lower temperature but can be heat-accelerated for faster cure time.

NuSil Technology, www.nusil.com

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