561-50 die attach adhesive attaches semiconductor die in temperature-sensitive devices. Is electrically conductive, and cures more than 90% cured after 30 min. at 80°C. Dispensing work life said to be greater than 48 hr. (measured as a 25% increase in viscosity). Exhibits damp heat resistance and conductivity stability. Fast cures at elevated temperatures (1 min.@180°C). For applications with high peel strength, smart cards, camera modules, flex circuits and other temperature-sensitive applications.

Engineered Materials Systems, www.conductives.com

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