Seho Systems Rolls Out MaxiReflow HP
Published: 12 February 2013
MaxiReflow HP void-free soldering combines convection heat and a hyper-pneumatic module. Is equipped with an excess pressure chamber. Each heating zone – as well as zones integrated in the hyper-pneumatic chamber – has a tangential fan. Can also be operated without activating hyper-pneumatic chamber.
SEHO Systems, www.seho.de
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