Indium Rolls Out Indium9.91 Solder Paste
Published: 19 March 2013
Indium9.91 no-clean solder paste is for package-on-package applications 0.3mm and larger. Rheology optimizes dipping and package retention. Reduces defects due to package warping; provides solderability; has long pot life, and provides consistent solder paste volumes. Can be used with SAC 305 and Sn63 alloys.
Indium, www.indium.com
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.