Aprotec Instrumentation Debuts Z-Check 3D SPI
Published: 15 April 2013
Z-Check 3D benchtop, noncontact, solder paste inspection and measurement system is said to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Provides large scanning area and unique 5-line LED scanning. Comes with full SPC package.
Aprotec Instrumentation, www.aprotecinstrumentation.co.uk
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