Indium Announces Indium6.4 Solder Paste
Published: 02 May 2013
Indium6.4 solder paste is water-soluble and said to minimize voiding under QFN and BGA assemblies. Reportedly yields less than five% voiding. Comes as standard type 3 powder in Sn63, Sn62, and Indalloy100 (tin, lead and silver).
Indium, www.indium.com
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