Inventec Releases SnBiAg Solder Paste
Published: 21 May 2013
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for temperature-sensitive components, shorter reflow cycle times and reduces energy.
Inventec, www.inventec.dehon.com
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