535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. Is designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and general bonding applications in photonics assembly. Reportedly cures rapidly when exposed to high-intensity UV light. Does not contain antimony.

Engineered Material Systems, www.emsadhesives.com

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