Conductor Analysis Technologies Debuts OM Thermal Stress System
OM thermal stress system offers assembly reflow simulation and thermal cycling and convection reflow simulation per IPC-TM-650, Method 2.6.27. Is built on air‐to-air thermal shock methodology, air-to-air thermal cycling from room temperature to +230°C. Is able to test 12 HATS, 24 IPC-2221B D-type, 12 IST or custom-designed coupon configurations. Includes precision data acquisition, one reading per net every sec., automatic data analysis and report generation.
Conductor Analysis Technologies, www.cat-test.info
TAGS: electronics assembly, convectio reflow, test
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