Sarcon GR25A-0H2-30GY is a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. Fills air gaps between board components and processors. Transfers heat with a thermal conductivity of 2.8 W/m°K per ASTM D2326 and a thermal resistance of .21°Cin²/W at 14.5 PSI (1.33°Ccm²/W at 100Kpa). Is a flame retardant TIM available in sheets up to 300mm x 200mm. Can be die-cut or trimmed to fit application specifications.

Fujipoly America Corp., www.fujipoly.com

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