DF-2000 series dry film negative photoresists are for hot roll lamination and processing on MEMS and IC wafers. Were developed for consistent photo speeds with +/- 3% critical dimension target. Are available in thickness formats from 5 to 50µm, +/- 5%. Have a glass transition temp. of 145°C  and a moderate modulus of 4.5 GPa at 25°C. Are hydrophobic and compatible with the EMS line of spin coatable photoresists.

Engineered Material Systems, www.emsadhesives.com

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