CA-165 conductive adhesive is for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules. Has a moderate glass transition temperature (Tg) and modulus. Has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement, and is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces.

Engineered Material Systems, www.emsadhesives.com

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