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SPI-Pilot 1.4 integrated system software includes 3D calculation. Includes enhanced algorithm for measured value determination; OptiCon SPI-Line 3D System provides measurement data for volume, offset and height of solder deposit. Offers extended module for statistical process control and real-time monitoring of printing process. Fault and work statistics are displayed as charts and tables. Can be controlled via tablet PC.

Goepel electronic, www.goepel.com  

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