Loctite TAF thermal absorbent films reportedly lower CPU and skin temperature of handheld devices by more than 3°C. Can absorb, spread, insulate and dissipate thermal energy generated by ICs. Create airflow route through which hot air can move out of device. Regulate heat and management of CPU temperature rise and fall. Are available in customized, pre-cut sizes and thicknesses. Film thickness and layer constructions can be adapted to create thinner or thicker solutions with multi-axis contourability.

Henkel, www.henkel.com/electronics

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