Indium8.9HF1-P Pb-free solder paste is designed to combine stencil printing, using halogen-free oxidation barrier technology, with no-clean residues for probe testing. Reportedly provides high transfer efficiency and consistent print performance, even at high speeds; lessens need for frequent under-stencil wiping. Prints well on apertures with area ratios <0.5 using low print pressures. Oxidation barrier technology eliminates defects such as head-in-pillow and graping. Has soft residue after reflow; residue remains probe-testable after multiple reflows, time between reflow and test, and baking.

Indium Corp., www.indium.com 

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