Universal Instruments Releases FuzionOF Platform
Published: 20 December 2013
FuzionOF platform addresses pre- and post-reflow odd-form assembly. Complements Generation 88HT through-hole portfolio and Polaris Assembly Cell for odd-form automation. Closed-loop processes reduce defects, rework and waste. Reportedly delivers highest available odd-form automation throughput.
Universal Instruments, www.uic.com
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.