535-10M-45 UV cured epoxy adhesive is formulated for disk drive, camera module, optoelectronic and circuit assembly applications. Contains a secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. Is designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, general bonding applications in photonics assembly. Cures rapidly when exposed to high-intensity UV light. Low outgassing. Contain no antimony.

Engineered Material Systems, www.emsadhesives.com

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