Nordson DAGE Launches XM8000 Wafer X-ray Metrology Platform
Published: 20 January 2014
XM8000 wafer x-ray metrology platform reveals optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. Provides
nondestructive, inline wafer measurement of voiding and fill levels, overlay and critical dimensions.
Nordson DAGE, www.nordsondage.com
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