Akrometrix Releases CXP (Convection Expandable Platform)
Published: 22 January 2014
CXP (Convection Expandable Platform) is for surface characterization of PCB local areas under reflow conditions. Is applicable for IPC-9641 concerning warpage measurement of PCB surface mount regions. Software compares warpage results to corresponding component warpage.
Akrometrix, www.akrometrix.com
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