EMS Introduces 585-1 Nonconductive Paste
Published: 29 January 2014
585-1 nonconductive paste provides reliability to gold stud bump interconnects used in flip-chip packaging. Has high fracture toughness and adhesion. Is ionically clean and cures in seconds during thermal compression bonding at 200°C.
Engineered Material Systems, www.emsadhesives.com
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