IDM1000 inline PCB assembly dicing system uses a high-speed diamond-coated cutting blade to separate PCBs from the matrix frame and adjacent circuits. Dust remediation is affected at the cutting head, vacuum is provided via two-off 5HP blowers and a three-stage filtration system capable of handling particles as small as 20 microns. Features robotic offload system with programmable X & Y pick-and-place board handling at the offload. Capacity for PCBs up to 300 x 200 x 2mm in thickness. Dicing speeds up to 200 mm/sec, positioning speeds up to 1000 mm/sec. Rotary fixture table for 360Φ.

Getech, getecha.com

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