LPKF Rolls Out MicroLine 2000 SI Laser Depaneling System
Published: 13 February 2014
MicroLine 2000 SI laser depaneling system is for rigid and flexible printed circuit boards. Reportedly benefits from a low-stress UV laser beam. Is for removing bare or populated circuits from panels. Reportedly can process any board material, from FR4 to fired ceramics to flexible and rigid-flex substrates.
LPKF, www.lpkfusa.com
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