535-10M-49 UV cured epoxy adhesive was formulated for disk drive, camera module, optoelectronic and circuit assembly applications. Contains a secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Is ultra-low stress, low shrinkage, and ionically clean, with low glass transition temperature. Designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and general bonding applications in photonics assembly.  Cures rapidly when exposed to high-intensity UV light.

Engineered Material Systems, www.emsadhesives.com

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