Cool-Pad CPR7154 thermal interface material dispenses like a thermal pad, but is said to show characteristics of a grease or gel when device temperatures increase to above 45°C. Is optimized to accommodate large areas with different heights and gaps of less than 3 mils along its interfacing area. Is filled with a modified oxide mixture and is electrically insulating at normal voltage. It is designed to have high compressibility. "Melt flows" at 45°C to fill trapped air along interface between device and heat-sink or heat-spreader. Is semi-tacky on both sides for thermal transfer performance. Thermal conductivity and Tg characteristics are said to impose minimum thermal stress on bonded parts during thermal cycling or shock testing. Is not designed for bonding.  Will fill in uneven height differentials and warps between the mating surfaces. For outdoor LED luminaire applications, CPU and GPU in Xbox360, Play Station, and other game consoles, and CPU modules and graphic card interfaces in laptops and desktops.

AI Technology, www.aitechnology.com

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