AIM Introduces NC273LT Solder Paste
Published: 16 April 2014
NC273LT solder paste for Bi-containing alloys is designed for low-temperature applications. Activator system said to improve wetting performance of bismuth alloys to RoHS-compliant plating and surface finishes. Reportedly offers excellent transfer efficiencies, long stencil life and minimizes solder balling.
AIM, aimsolder.com
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