Mirtec Introduces MV-9 SIP, MP-7 Micro Inspection
Published: 23 June 2014
MV-9 SIP is configured with Omni-Vision 2D/3D technology for semiconductor inspection. Combines 25Mp CoaXPress 2D ISIS vision system with digital multi-frequency quad Moiré 3D system for inspection of semiconductor assemblies. Features four 10Mp side-view cameras and 25Mp top-down camera. MP-7 Micro is designed for BGA ball inspection. Is configured with 15Mp ISIS vision system, a 6µm telecentric compound lens and color strobe LED lighting.
Mirtec, www.mirtec.com
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