Loctite Eccobond NCP 5209 nonconductive paste is designed for fine-pitch flip-chips. Delivers underfill protection. Is pre-applied onto substrate, facilitating bump protection and interconnection. Formulated for Cu pillar bumps and Cu OSP substrate pad finishes, it reportedly offers bump reinforcement and safeguarding for devices with pitches of less than 100µm and gaps less than 40µm. Has stage life up to 2 hr. at 70°C. Passed MSL3 testing. Withstands up to 1,000 thermal cycles. Is capable of high-temperature storage of up to 1,000 hr. at 150°C.

Henkel Electronics Group, www.henkel.com/electronics
 

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