SI 7.47 software release has improved downlink function for solder paste inspection (SPI), automated AOI assurance, and includes new µBGA analysis, among other features. Has closed-loop interfaces to MPM and Panasonic printers and extended connections to DEK and Ekra printers. Now supports print process without barcodes. Integrated Verification facilitates simple assurance of AOI inspection program quality by automatically saving all defect images acquired at the verification station and making them available for future optimization or generation of new inspection plans. Extends µBGA inspection by an analysis with features combination that conjoins and evaluates completely different features. New converter changes all relevant parameters of the inspection pattern automatically, at the press of a button. 

Viscom, www.viscom.com

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