Sigma X 3D inline solder paste inspection machine features dual-laser technology to eliminate shadowing; application bandwidth that is compatible with all PCB colors and finishes, including HASL; measurement height range of  +/- 1mm (0.040”) standard and optional  +/- 2mm (0.080″); and identification features including via holes, edge of board and routing to reduce false calls. Industry’s best PCB warp-management system with real-time Z axis that tracks to the PCB surface. Novel jet defect repair  adds paste to pads with insufficient deposits, eliminating rework and board scrap. Accommodates PCBs up to 580 x 510mm (23″ x 20″). Height repeatability: 3 Sigma <1µm. Volume repeatability: 3 Sigma <1%. Height accuracy: 2µm. Paste size 100 x 100 µm minumum; 20 x 20mm maximum.

Parmi, http://parmi.com/spi-application-products-overview/sigma-x/http://parmi.com/spi-application-products-overview/sigma-x/

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