Inspect-X 4.1 acquisition and analysis software for x-ray and CT systems provides improved real-time imaging and advanced BGA analysis. Real-time image enhancements provide easy-to-interpret images for fast online defect recognition. Image processing algorithms enable automated BGA analysis and reporting for stacked components and multilayer boards. Intelligently adapts to changing x-ray conditions and sample positions, automatically adjusting image controls, contrast and brightness to provide clear, sharp images to aid in defect recognition. Enhancements and filters can be chosen and stored as user profiles to suit different sample types or individual operator preferences. New BGA tool provides powerful image processing, fully automated analysis and detailed reporting to inspect complex packages such as package-on-package (PoP) or dual-layered boards. Features a user-friendly template creation GUI of each BGA package, detailing array dimensions, positions and geometries using a wizard or directly imported from file. Automatically inspects each ball using advanced void analysis featuring single and total void percentage per ball. Also checks ball count, circularity, under- or oversizing, bridging and misalignment defects. Built-in reporting features overlay the x-ray images with color-coded analysis for easy interpretation. Is for large batch inspection; can inspect multiple boards in one routine.

Nikon Metrology, www.nikonmetrology.com

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