M8 no-clean solder paste, for high-density electronics assemblies, has been developed in combination with T4 and finer mesh Pb-free alloy powders. Reportedly provides stable transfer efficiencies. Novel activator system provides durable wetting action accommodating a range of profiling processes and techniques. Reportedly eliminates HiP defects on BGAs and reduced voiding on QFN/BTC components. Based on NC258 platform.

AIM Solder, www.aimsolder.com

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