535-11M-7 UV cured epoxy was developed to pass the reliability requirements in disk drive, camera module, photonics and circuit assembly applications. Is an ultra-low stress, lower glass transition temp. version of 535-10M-1 UV cure adhesive. Can be used for lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Reportedly cures rapidly when exposed to high-intensity UV light. Is a low outgassing, flexible, high-strength epoxy adhesive that does not contain antimony.

Engineered Material Systems, www.emsadhesives.com

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