Place-n-Bond underfilm is now offered with glue dots preapplied to the strip as an alternative for tacky pads. Testing now integrates into a standard SMT feeder. A thinner version of underfilm helps improve LGAs during shock, drop, and thermal cycling testing. Is a preformed thermoplastic packaged in tape and reel that is picked and placed with an existing SMT feeder. Bonds during reflow process and can be used in BGA reliability, flex-circuit-to-rigid-board bonding, encapsulating, and sealing. No dispensing, additional cure time or cold storage is required.

Alltemated, www.alltemated.com

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