TC-3040 thermally conductive gel is a thermal interface material (TIM-1) developed with the help of IBM. Reportedly offers more reliable
thermal management, reduced stress and excellent under-die coverage for flip chip applications. Is said to deliver nearly two times the thermal performance of other industry standard TIMs, as well as high thermal conductivity targeting 4W/mK with reliability. Offers broader design options for high-performing, reliable ICs.

Dow Corning, www.dowcorning.com

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