SBX02 alloy has a melting point below 140°C and can be used with peak reflow profiles between 155° and 190°C. Permits through-hole components requiring low peak temperature to be soldered by pin-in-paste low-temperature reflow, eliminating wave soldering. Features mechanical strength, the ability to absorb impact energy and improved drop shock resistance over SnBi0.4Ag alloy. Low voiding in BGA solder joints.

Alpha, alpha.alent.com/en/Solutions/Process/Low-Temperature-Alloys

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