Fineplacer Sigma semiautomated die bonder is for large die up to 100mm, combined with a working area of 450 x 300high-density array applications and high bond force (up to 1000N) requirements. Handles a wide variety of wafer-level packaging (FOWLP, W2W, C2W) with high bump count used to assemble MEMS/MOEMS, IR/ image sensors, focal plane arrays, and high power device packaging, including assembly of 2.5D and 3D IC packages. Also can pick up from and bond to 300mm wafers. Vision alignment system provides high resolution at all magnification levels and real-time optimized camera images. Touch screen magnifiers allow zoomed images anywhere in the field of view. Two high definition cameras and specially developed optics ensure that the cameras' full resolution potential is tapped. Features pattern recognition.

Finetech USA, www.finetechusa.com

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