S3X58-M555 halogen-free solder paste maintains activation by suppressing activator reaction at room temperature. Shows melt-ability during reflow process. Multiple activators have been encapsulated and blended. Withholding activation at room temperature, viscosity can be stabilized. Is said to show no deterioration on surface insulation resistance after 200 hr. on moisture cycle test. Wets and spreads without dewetting and inhibits head-in-pillow on BGAs. Is compatible with automotive applications.

Koki Solder America, www.kokiamerica.com

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