X-Line 3D inline AXI now comes “X40 Plus” for 3D inspection speed increase of up to 18%. Optimized imaging chain in combination with an improved axle system and faster execution of test algorithms results in cycle time savings, depending on maximum resolution and board dimensions. A 216 x 164mm assembly with more than 8,000 solder joints requires about 40 sec. for complete 3D X-ray inspection. For double-sided boards; captures top and bottom sides within a single pass. Based on a real time multi-angle image, recording a complete 3D inspection of the assembly is possible. Integrated reconstruction methods based on digital thomosynthesis enables the defined evaluation of individual layers of the circuit board under test.

Goepel Electronics, www.goepel.com 

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