Shenmao Releases PF608-PI-21, PF606-P-BS1 Bumping Solder Pastes
Published: 12 October 2015
PF608-PI-21 (SnAg4.0Cu0.5/x) and PF606-P-BS1 (SnAg3.0Cu0.5/x) bumping solder pastes are designed to decrease voids in wafer bumping. Are said to offer excellent stencil printing transfer rates and void rates of <10%.
Shenmao America, www.shenmao.com
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